4HP, single slot quad or dual core CPU rugged air or conduction cooled
Scalable processor speed, Intel® Core™ i7 3rd generation up to 2.5 GHz
Up to 16GB DDR3 1600 MHz soldered memory with ECC
Up to 5x GigEthernet Interfaces via PCIExpress
Latest IO technology with SATA Gen 3, RAID, SSD
XMC/PMC + SSD Flash configuration possible
Rear I/O supporting PICMG 2.16
Highest Quad / Dual Core Performance in 22nm Technology for Harsh Environments
The CP6004-RA/RC, a CompactPCI PICMG 2.16 compliant 6U CPU board, comes with various rugged levels, making it yet another addition to Kontron’s rugged PICMG 2.16 portfolio.
Based on the Intel® Core™ i7 third generation processor and the QM77 platform controller hub, the CP6004-RA/RC is featured by dual or quad core computing performance at a reasonable thermal design power, including a complete set of data, communication and multimedia interfaces.
The CP6004-RA version is designed for harsh application requirements in air-cooled environments, where the CP6004-RC is made for conduction cooled environments.
With the 2.1 GHz Intel® Core™ i7-3612QE and the LV 2.5 GHz Intel® Core™i7-3555LE, the CP6004-RA/RC has extraordinary performance per watt values. Up to 16 GByte of soldered DDR3 1600 MHz memory with ECC provide the foundation of demanding software applications.
Based on the Intel® Mobile QM77 I/O controller hub the CP6004-RA/RC provides high graphics performance for VGA and two independent digital video outputs to the rear I/O as well as HDA audio capabilities.
Besides the outstanding graphics performance, the CP6004-RA/RC offers comprehensive I/O capability with up to 5x 1Gb Ethernet, 4 x rear I/O SATA with RAID 0/1/5/10 functionality, a local SATA Flash disk connector, as well as 6x USB 2.0, 2 x COM.
It can also accommodate a conduction cooled PMC/XMC slot for I/O intensive applications.
The board provides safety and security via an optional trusted platform module, (TPM 1.2), two redundant firmware hubs (failover) and IPMI support according PICMG 2.9 R1.0.