3U VPX Xilinx® Virtex®-5 FPGA Processor Board with FMC Site
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3U VPX Carrier Board for VITA 57 FPGA Mezzanine Cards (FMC)

VX3830 is a 3U FPGA Mezzanine Card (FMC) carrier board based on a Xilinx® Virtex®-5 FPGA. VX3830 is a member of Kontron's VITA 46 VPX Ecosystem which facilitates the implementation of VPX through an integrated offering.

The VITA 57 FMC standard defines an I/O mezzanine module connected to an FPGA located on a base-board or carrier board. It allows the I/O interface to be physically separated from the FPGA design and thus ease I/O interface module design changes while maximizing the carrier card


FMC modules are about half the size of PMC or XMC modules (similar width), but provide higher density host I/O.

  • Increased I/O Flexibility and Scalable Development Solutions
  • x4 or x1 PCI-Express Backplane Interface
  • Standard Air- and Rugged Conduction-Cooled Versions


Standard Commercial: -1,640 to 15,000 ft; Rugged Conduction-Cooled: -1,640 to 50,000 ft
Convection or Conduction
Dimensions (H x W x D)
99.85 mm x 162.54 mm; 0.8 inch face plate. (1 inch is a built option)
Standard Commercial: 90% without condensation; Rugged Conduction-Cooled: 95% without condensation
FMC: 64 bits I/Os routed to VPX P2
VPX: PCI-Express interface to VPX Data Plane 1 (P1 wafers 1 to 4). Interface to Data Plane 2 (P1 wafers 5 to 8) is a build option
Operation Temperature
Standard Commercial: 0° to +55°C; Rugged Conduction-Cooled: -40° to +85°C
Xilinx® Virtex®-5 FPGA
Standard Commercial: 20g/11 ms Half Sine; Rugged Conduction-Cooled: 40g/11 ms Half Sine
Standard Commercial: 0° to +55°C; Rugged Conduction-Cooled: -40° to +85°C
Standard Commercial: 20/500 Hz: 2g; Rugged Conduction-Cooled: 22/2,000 Hz: 2g

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