3U VPX Carrier Board for VITA 57 FPGA Mezzanine Cards (FMC)
VX3830 is a 3U FPGA Mezzanine Card (FMC) carrier board based on a Xilinx® Virtex®-5 FPGA. VX3830 is a member of Kontron's VITA 46 VPX Ecosystem which facilitates the implementation of VPX through an integrated offering.
The VITA 57 FMC standard defines an I/O mezzanine module connected to an FPGA located on a base-board or carrier board. It allows the I/O interface to be physically separated from the FPGA design and thus ease I/O interface module design changes while maximizing the carrier card
FMC modules are about half the size of PMC or XMC modules (similar width), but provide higher density host I/O.
|Altitude||Standard Commercial: -1,640 to 15,000 ft; Rugged Conduction-Cooled: -1,640 to 50,000 ft|
|Cooling||Convection or Conduction|
|Dimensions (H x W x D)||99.85 mm x 162.54 mm; 0.8 inch face plate. (1 inch is a built option)|
|Humidity||Standard Commercial: 90% without condensation; Rugged Conduction-Cooled: 95% without condensation|
|Interface||FMC: 64 bits I/Os routed to VPX P2|
|Interface||VPX: PCI-Express interface to VPX Data Plane 1 (P1 wafers 1 to 4). Interface to Data Plane 2 (P1 wafers 5 to 8) is a build option|
|Operation Temperature||Standard Commercial: 0° to +55°C; Rugged Conduction-Cooled: -40° to +85°C|
|Processor||Xilinx® Virtex®-5 FPGA|
|Shock||Standard Commercial: 20g/11 ms Half Sine; Rugged Conduction-Cooled: 40g/11 ms Half Sine|
|Temperature||Standard Commercial: 0° to +55°C; Rugged Conduction-Cooled: -40° to +85°C|
|Vibration||Standard Commercial: 20/500 Hz: 2g; Rugged Conduction-Cooled: 22/2,000 Hz: 2g|